Company Filing History:
3 out of 7,085 
3 out of 18 Years Active: 1997-2017
Title: Innovations by Qingming Shu
Introduction
Qingming Shu is a notable inventor based in Beijing, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of enhanced flash chips and packaging methods. With a total of six patents to his name, his work addresses critical challenges in design complexity and cost efficiency.
Latest Patents
Among his latest patents are the SPI interface enhanced flash chip and a chip packaging method. These innovations aim to solve issues related to high design complexity, long design periods, and elevated design costs. The enhanced flash chip integrates SPI FLASH and RPMC, each equipped with independent controllers. The design allows for mutual connection of the same IO pins in both components, facilitating communication through shared external pins. This innovative approach not only reduces package size but also decreases design costs and improves overall chip performance.
Career Highlights
Qingming Shu has worked with prominent companies in the semiconductor industry, including United Microelectronics Corporation and Gigadevice Semiconductor (Beijing) Inc. His experience in these organizations has contributed to his expertise in chip design and development.
Collaborations
Some of his notable coworkers include Hongyi Chen and Hong Hu, who have collaborated with him on various projects in the semiconductor field.
Conclusion
Qingming Shu's contributions to semiconductor technology through his innovative patents and career achievements highlight his role as a leading inventor in the industry. His work continues to influence advancements in chip design and performance.