Qiaodan Li

Title: Qiaodan Li: Innovator in Integrated Circuit Technology

Introduction

Qiaodan Li is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances manufacturing processes in this industry.

Latest Patents

Qiaodan Li holds a patent titled "Method of back end of line metal via process." This patent describes a comprehensive method for forming a via and a trench that communicate longitudinally. The process includes forming a TiN barrier layer, a Co seed layer, and filling the via with Co through electrochemical deposition. Additionally, it involves creating a TiN hard mask layer, removing the Co seed layer, and applying a TaN/Ta barrier layer, followed by a liner layer and a Cu seed layer. The process culminates in filling the trench with Cu and performing top planarization. This innovative method showcases his expertise in enhancing semiconductor manufacturing techniques.

Career Highlights

Qiaodan Li is currently employed at Shanghai Huali Integrated Circuit Corporation. His role at the company allows him to apply his inventive skills in a practical setting, contributing to advancements in integrated circuit technology. His work is recognized for its impact on improving manufacturing efficiency and product quality.

Collaborations

Qiaodan has collaborated with notable colleagues, including Dong Zhao and Pengfei Wang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Qiaodan Li's contributions to integrated circuit technology through his patent and work at Shanghai Huali Integrated Circuit Corporation highlight his role as a key innovator in the field. His dedication to advancing manufacturing processes is evident in his innovative methods.