The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jan. 25, 2024
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Abstract
The present application form a via and a trench longitudinally communicating with the via; forming a TiN barrier layer on an inner surface of the trench and on an inner surface of the via; forming a Co seed layer on a surface of the TiN barrier layer; fully filling the via with Co by means of electrochemical deposition; forming a TiN hard mask layer over the Co on the bottom of the trench; removing the Co seed layer on sidewalls of the trench; removing the TiN hard mask layer on the bottom of the trench; covering the sidewalls and bottom of the trench with a TaN/Ta barrier layer; covering the TaN/Ta barrier layer with a liner layer; growing a Cu seed layer over the liner layer in the trench; and filling the trench with Cu by means of electrochemical deposition, and performing top planarization.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile