Qian Wang

Title: Innovations of Qian Wang: Pioneering Wafer Level Packaging Solutions

Introduction

Qian Wang, an inventor based in Yongin-si, South Korea, has made significant contributions to the field of semiconductor technologies. With a record of 2 patents, his innovative approaches have enhanced device packaging methodologies, which are critical in the advancement of electronic devices.

Latest Patents

Qian Wang's latest patents include two noteworthy inventions focused on wafer level packaging:

1. **Wafer Level Packaging Cap and Fabrication Method Thereof**: This invention pertains to a wafer level packaging cap designed to cover a device wafer containing various electronic devices. The innovative cap wafer features a cavity on its bottom surface, specifically tailored to receive the device. Metal lines are strategically formed to connect with device pads, facilitating electrical connections. Notably, the design includes buffer portions and connection rods that enhance durability and performance.

2. **Cap for Semiconductor Device Package and Manufacturing Method Thereof**: This patent encapsulates a cap designed for semiconductor packages. It highlights a body that contains a cavity and features via holes with seed layers that enable efficient plating. This structure is crucial for ensuring reliable connectivity and integrity in semiconductor applications.

Career Highlights

Qian Wang is employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung combines creative inventiveness with technical expertise, positioning him as a key player in the development of innovative semiconductor solutions. His patents reflect his commitment to advancing technology in this competitive field.

Collaborations

Throughout his career, Qian Wang has collaborated with esteemed colleagues, including Moon-chul Lee and Kae-dong Back. These partnerships have fostered a collaborative environment conducive to innovation, allowing for the exploration and enhancement of new technologies in semiconductor packaging.

Conclusion

Qian Wang's contributions to the field of wafer level packaging through his inventive patents highlight his role as a pioneer in semiconductor technology. His affiliation with Samsung Electronics Co., Ltd. and collaborations with industry peers further underscore the significance of his work in driving advancements that impact modern electronics.