The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Apr. 28, 2006
Moon-chul Lee, Yongin-si, KR;
Jong-oh Kwon, Suwon-si, KR;
Kae-dong Back, Yongin-si, KR;
Qian Wang, Yongin-si, KR;
Jun-sik Hwang, Yongin-si, KR;
Kyu-dong Jung, Suwon-si, KR;
Moon-chul Lee, Yongin-si, KR;
Jong-oh Kwon, Suwon-si, KR;
Kae-dong Back, Yongin-si, KR;
Qian Wang, Yongin-si, KR;
Jun-sik Hwang, Yongin-si, KR;
Kyu-dong Jung, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.