Hsinchu City, Taiwan

PO-Han Wang

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: PO-Han Wang. Retrieved from https://idiyas.com/inventor/po-han-wang-1azdeazz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: PO-Han Wang and Semiconductor Interposer Alignment

Introduction

PO-Han Wang is an inventor associated with Hsinchu City, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work addresses semiconductor packaging and the accurate placement of components within composite interposers.

Latest Patents

Wang is named on 1 patent: “Alignment Mark Via Assemblies for a Composite Interposer and Methods of Using the Same.” The invention describes forming repeated via assemblies across a carrier wafer. Each unit area includes through integrated-fan-out via structures and two diagonally spaced alignment-mark via assemblies in corner regions. These marks help identify unit-area corners, enabling a pick-and-place tool to position at least one local silicon interconnect bridge within each area.

Career Highlights

Wang’s listed patent reflects work on alignment techniques for semiconductor structures. The disclosed method combines repeated wafer-level assemblies with alignment marks to support precise placement during interposer fabrication.

Collaborations

Wang’s listed coworker is Wei-An Tsao. The patent concerns a semiconductor structure and manufacturing method associated with Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

PO-Han Wang’s patent focuses on using diagonally positioned alignment-mark via assemblies to guide accurate component placement in composite interposer manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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