This inventor holds 4 USPTO granted patents and 5 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 481 
2 out of 42,872 
Years Active: 2026
Title: The Innovations of PO-Chen Lai
Introduction
PO-Chen Lai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and performance of semiconductor packages.
Latest Patents
One of PO-Chen Lai's latest patents is titled "Semiconductor packages with thermal lid and methods of forming the same." This patent discloses a method that includes bonding a semiconductor chip package to a substrate and depositing a thermal interface material on the semiconductor chip package. A thermal lid is placed over and adhered to the semiconductor chip package by the thermal interface material. The thermal lid features a wedge that interfaces with the thermal interface material, and it is adhered to the semiconductor chip package by curing the thermal interface material.
Another significant patent is "Embedded stress absorber in package." This method involves bonding a first package component over a second package component, which includes multiple dielectric layers and redistribution lines. The process further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on both the second package component and the stress absorber.
Career Highlights
PO-Chen Lai is currently employed at Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His work at this prestigious organization has allowed him to contribute to groundbreaking advancements in semiconductor packaging technology.
Collaborations
Throughout his career, PO-Chen Lai has collaborated with talented individuals such as Shu-Shen Yeh and Shin-Puu Jeng. These collaborations have fostered innovation and have led to the development of advanced semiconductor solutions.
Conclusion
In summary, PO-Chen Lai is a prominent inventor whose work in semiconductor technology has led to significant advancements in the field. His patents reflect his commitment to innovation and excellence in semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile