Taipei, Taiwan

Pin-Chung Lin

This inventor holds 1 USPTO granted patent. Top assignee: Kinsus Interconnect Technology Corp.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pin-Chung Lin. Retrieved from https://idiyas.com/inventor/pin-chung-lin-x105sg7e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Innovations of Pin-Chung Lin in Circuit Board Manufacturing

Introduction

Pin-Chung Lin is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit board manufacturing. His innovative methods have paved the way for advancements in electronic components.

Latest Patents

Pin-Chung Lin holds a patent for a "Method for manufacturing circuit board." This patent discloses a comprehensive process that includes preparing a substrate with a resin layer and a stop layer. The method involves forming conduction holes, applying metal layers through sputtering and chemical plating, and utilizing electroplating to fill the conduction holes. The resulting circuit pattern boasts a line width/pitch of less than 10 µm, showcasing his expertise in fine line technology.

Career Highlights

Lin is associated with Kinsus Interconnect Technology Corp., where he applies his innovative techniques in circuit board production. His work has been instrumental in enhancing the quality and reliability of electronic devices.

Collaborations

He has collaborated with notable colleagues such as Jaen-Don Lan and Chen-Rui Tseng, contributing to various projects within the company.

Conclusion

Pin-Chung Lin's contributions to circuit board manufacturing exemplify the importance of innovation in technology. His patent and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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