Pierpaolo Recanatini

Title: The Innovations of Pierpaolo Recanatini

Introduction

Pierpaolo Recanatini is a notable inventor based in Ornago, Italy. He has made significant contributions to the field of semiconductor technology, holding three patents to his name. His work reflects a deep understanding of electronic components and their applications in modern technology.

Latest Patents

One of his latest patents is focused on a semiconductor device and the corresponding method. This invention features a leadframe that includes a die pad and a set of electrically conductive leads. A semiconductor die, which has a front surface and a back surface, is arranged on the die pad with the front surface facing away from it. The semiconductor die is electrically coupled to the conductive leads. Additionally, a package molding material is molded over the semiconductor die arranged on the die pad. A stress-absorbing material is contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die, positioned between at least one selected portion of the front surface and the package molding material.

Career Highlights

Pierpaolo has worked with prominent companies in the semiconductor industry, including STMicroelectronics S.r.l. and STMicroelectronics (Malta) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Pierpaolo has collaborated with talented individuals such as Roseanne Duca and Dario Paci. These collaborations have further enriched his work and expanded his impact in the field.

Conclusion

Pierpaolo Recanatini's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape advancements in the industry, showcasing the importance of innovation in technology.