The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Sep. 27, 2019
Applicants:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Stmicroelectronics (Malta) Ltd, Kirkop, MT;

Inventors:

Marco Del Sarto, Monza, IT;

Alex Gritti, Vimercate, IT;

Pierpaolo Recanatini, Ornago, IT;

Michael Borg, Birkirkara, MT;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/49822 (2013.01);
Abstract

The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.


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