Stmicroelectronics S.r.l.

Stmicroelectronics (malta) Ltd

Pierpaolo Recanatini

Dario Paci

Roseanne Duca

Marco Del Sarto

Alex Gritti

Michael Borg

A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

Semiconductor device and corresponding method

The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.

Semiconductor package with wettable slot structures

Growing community of inventors

Ornago, Italy

Pierpaolo Recanatini