Pi-Huang Lee

Title: Innovations by Pi-Huang Lee

Introduction

Pi-Huang Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to resistivity measurement and testing systems.

Latest Patents

One of his latest patents is titled "Mechanisms for resistivity measurement of bump structures." This invention provides mechanisms for measuring the resistivity of bumps without damaging devices or requiring a customized probing card. By utilizing designated bumps on the corners of dies, the resistivity can be measured across the entire wafer, allowing for the monitoring of process stability and health.

Another significant patent is the "Universal array type probe card design for semiconductor device testing." This universal system enables the testing of various semiconductor devices through a probe head with a versatile probe pattern. Each bump or pad of the test pattern contacts a corresponding probe, facilitating effective testing of different semiconductor devices.

Career Highlights

Pi-Huang Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and contribute to advancements in semiconductor technology. His work has been instrumental in enhancing testing methodologies and improving the reliability of semiconductor devices.

Collaborations

He collaborates with esteemed colleagues, including Hsu Ming Cheng and Yung-Liang Kuo, who contribute to the innovative environment at their workplace.

Conclusion

Pi-Huang Lee's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.