The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jan. 25, 2011
Applicants:
You-hua Chou, Taipei, TW;
Mill-jer Wang, Hsinchu, TW;
Pi-huang Lee, Hsinchu, TW;
Jeff Wang, Chu-Pei, TW;
Feynmann Chu, Taipei, TW;
Inventors:
You-Hua Chou, Taipei, TW;
Mill-Jer Wang, Hsinchu, TW;
Pi-Huang Lee, Hsinchu, TW;
Jeff Wang, Chu-Pei, TW;
Feynmann Chu, Taipei, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
The embodiments described above provide mechanisms for bump resistivity measurement. By using designated bumps on one or more corners of dies, the resistivity of bumps may be measured without damaging devices and without a customized probing card. In addition, bump resistivity may be collected across the entire wafer. The collected resistivity data may be used to monitor the stability and/or health of processes used to form bumps and their underlying layers.