The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Oct. 20, 2006
Applicants:

Hsu Ming Cheng, Hsin-chu, TW;

Yung-liang Kuo, Hsin-Chu, TW;

Pi-huang Lee, Hsinchu, TW;

Ann Luh, Hsinchu, TW;

Frank Hwang, Hsin-Chu, TW;

Wen-hung Wu, Hsinchu, TW;

Inventors:

Hsu Ming Cheng, Hsin-chu, TW;

Yung-Liang Kuo, Hsin-Chu, TW;

Pi-Huang Lee, Hsinchu, TW;

Ann Luh, Hsinchu, TW;

Frank Hwang, Hsin-Chu, TW;

Wen-Hung Wu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01); G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A universal system for testing different semiconductor devices provides a probe head with a probe pattern that may be used to test different test patterns formed on different semiconductor devices. Each of a plurality of bumps or pads of the test pattern contacts a corresponding probe of the probe head to enable the semiconductor device to be tested. The universal probe head may additionally or alternatively include a substrate design on the probe head that provides a pattern on the substrate of the probe head that may be used in conjunction with different patterns formed on a plurality of different printed circuit boards for testing different semiconductor devices.


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