Company Filing History:
Years Active: 1989-1993
Title: Innovations of Phillip H Williams
Introduction
Phillip H Williams is a notable inventor based in Mesa, AZ. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the manufacturing processes and characteristics of semiconductor devices.
Latest Patents
One of his latest patents involves a method for simultaneously measuring the thickness and composition of a film on a semiconductor wafer. In this innovation, a semiconductor wafer with a lattice mismatched film is placed on a flat support surface. A laser beam is directed onto the film, allowing for the measurement of the wafer's curvature, which is then used to calculate strain and film composition based on known properties.
Another significant patent by Williams is related to a multilayer trench isolation process and structure. This invention enhances the manufacturing of dielectric filled isolation walls for semiconductor devices. The process involves etching trenches in a semiconductor substrate and refilling them with multiple layers of silicon oxy-nitride. The use of alternative oxygen-rich and nitrogen-rich layers improves the characteristics and ease of manufacture of integrated circuits.
Career Highlights
Phillip H Williams is currently employed at Motorola Corporation, where he continues to innovate in the semiconductor field. His work has contributed to advancements in technology that are crucial for modern electronic devices.
Collaborations
Williams has collaborated with notable coworkers, including Bridgette A Bergami and Clifford I Drowley. Their combined expertise has furthered the development of innovative solutions in semiconductor technology.
Conclusion
Phillip H Williams is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the field. His contributions continue to impact the industry positively.