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For the Inventor, By the Inventor

Millbrook, NY, United States of America

Philip L Campbell

This inventor holds 7 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip L Campbell. Retrieved from https://idiyas.com/inventor/philip-l-campbell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal7 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2006-2011

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7 patents (USPTO):Explore Patents
1. 7992734 - Semiconductor automation buffer storage identification system and method (2011-08-09),
2. 7887277 - Reticle storage pod (RSP) transport system utilizing FOUP adapter plate (2011-02-15),
3. 7720956 - Method, system, and storage medium for providing continuous communication between process equipment and an automated material handling system (2010-05-18),
4. 7677180 - Apparatus and method for steering transport vehicles in semiconductor processing (2010-03-16),
5. 7591624 - Reticle storage pod (RSP) transport system utilizing FOUP adapter plate (2009-09-22),
6. 7426555 - Method, system, and storage medium for providing continuous communication between process equipment and an automated material handling system (2008-09-16),
7. 7103458 - Automation system using wireless high frequency (2006-09-05),

Title: The Innovations of Philip L Campbell

Introduction

Philip L Campbell is a notable inventor based in Millbrook, NY (US). He has made significant contributions to the field of semiconductor automation, holding a total of 7 patents. His work focuses on enhancing the efficiency and effectiveness of wafer transport and storage systems.

Latest Patents

Among his latest patents is the "Semiconductor automation buffer storage identification system and method." This innovative system involves reading substrate carriers using an overhead transport vehicle (OHT) equipped with devices for sensing and reading substrate carriers and wafers. The method allows for efficient sensing and reading of these components when they are near the OHT. Another significant patent is the "Reticle storage pod (RSP) transport system utilizing FOUP adapter plate." This invention combines a FOUP (front opening unified pod) system with a reticle system for transporting wafers and reticles between fabrication sites. It features a modified FOUP base structure that retains a reticle and requires minimal modifications to existing equipment, making it universally adaptable.

Career Highlights

Philip L Campbell is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the semiconductor field. His work has been instrumental in developing systems that streamline the transport and storage of critical components in semiconductor manufacturing.

Collaborations

Throughout his career, Campbell has collaborated with notable colleagues, including Edward Sherwood and Uldis Artis Ziemins. These partnerships have contributed to the advancement of technology in the semiconductor industry.

Conclusion

Philip L Campbell's contributions to semiconductor automation through his innovative patents and collaborations highlight his significant role in the industry. His work continues to influence the efficiency of wafer transport and storage systems, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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