Philip A Trask

Title: **Innovator Philip A. Trask: Pioneering Fine Pattern Electronic Interconnects**

Introduction

Philip A. Trask, an eminent inventor based in Laguna Hills, CA, has made significant strides in the field of electronic interconnect technology. With a remarkable portfolio of eight patents, Trask is recognized for his innovative approaches to fine pattern electronic interconnections, primarily utilizing phase mask laser fabrication techniques.

Latest Patents

Trask's most recent patents include groundbreaking methods for phase mask laser fabrication of fine pattern electronic interconnects. His inventions describe procedures for fabricating high-density fine pattern feature electrical interconnection structures. These innovations focus on utilizing a phase mask laser patterned dielectric layer as both a conductor wet etch masking layer and for subtractively removing metal via holographic phase mask laser micromachining. The patents detail the process of building a substrate that includes a layered assembly of dielectric and metal materials, all carefully manipulated through laser irradiation to precisely define metal conductor patterns corresponding to interconnect structures.

Career Highlights

Throughout his illustrious career, Trask has contributed to major companies, including Hughes Aircraft Company and Raytheon Company. His expertise and focus on the intricate details of electronic interconnect technology have positioned him as a leader in the innovative landscape of this cutting-edge field.

Collaborations

Trask has collaborated with several noteworthy colleagues, including Vincent A. Pillai and Gabriel G. Bakhit. These partnerships have fostered a rich exchange of ideas and advancements, further pushing the boundaries of electronic interconnection technologies.

Conclusion

Philip A. Trask exemplifies the spirit of innovation through his significant contributions to the field of electronic interconnect technologies. With his patented advancements in phase mask laser fabrication, he continues to influence the future of high-density electrical interconnection systems. His work not only enhances the efficiency and effectiveness of electronic components but also ensures that he remains a pivotal figure in the world of invention.