Peter Wang

Title: The Innovative Contributions of Peter Wang

Introduction

Peter Wang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

Wang's latest patents include innovative designs for semiconductor packages. One of his patents describes a method of manufacturing semiconductor packages that involve electrically coupling multiple die to an upper and lower lead frame. This technology allows for the bending of leads in the upper lead frame, which supports the die before encapsulation. This design ensures that the package contacts are on the same side, optimizing the layout for printed circuit boards. Another patent features a semiconductor package that interposes a die between cup-shaped lead frames, allowing for coplanar contacts that can be easily surface-mounted. The use of solder layers with predetermined thicknesses enhances the package's performance through thermal cycles.

Career Highlights

Throughout his career, Peter Wang has worked with prominent companies in the semiconductor industry, including Siliconix Incorporated and Vishay Siliconix. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.

Collaborations

Wang has collaborated with several professionals in his field, including Frank Kuo and Serge Jaunay. These collaborations have further enriched his work and innovations in semiconductor packaging.

Conclusion

Peter Wang's contributions to semiconductor technology are noteworthy, with his patents reflecting a commitment to innovation and efficiency. His work continues to influence the industry and pave the way for future advancements in semiconductor packaging.