Peter D Brandenburger

Title: Innovations of Peter D Brandenburger

Introduction

Peter D Brandenburger is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His work primarily focuses on enhancing the efficiency and effectiveness of heat transfer in electronic devices.

Latest Patents

Brandenburger's latest patents include innovative technologies such as an apparatus and methods for an underfilled integrated circuit package. This invention involves first and second substrate structures with underfill injected into a substrate structure interface through a feature of the substrate structure, along with a heat spreader. Another notable patent is the integrated heat spreader package for heat transfer and bond line thickness control. This system incorporates a thermal interface material (TIM) to facilitate heat transfer from a die to a heat spreader, featuring a heat transfer subsystem on the backside surface of the die.

Career Highlights

Peter D Brandenburger is currently employed at Intel Corporation, where he continues to push the boundaries of technology in the semiconductor industry. His work has been instrumental in developing solutions that improve the performance and reliability of electronic components.

Collaborations

Throughout his career, Brandenburger has collaborated with talented individuals such as Kris J Whittenburg and Fay Hua. These partnerships have fostered innovation and contributed to the advancement of technology in their respective fields.

Conclusion

Peter D Brandenburger's contributions to integrated circuit packaging and heat transfer technologies highlight his role as a leading inventor in the industry. His patents reflect a commitment to innovation and excellence in engineering.