Intel Corporation

Peter D Brandenburger

Fay Hua

Sabina J Houle

Carl L Deppisch

Hong Xie

Biju Chandran

Imran Yusuf

Hamid Ekhlassi

Johnny M Cook, Jr

Kim L Phillippe

Kris J Whittenburg

Embodiments of the present invention include first and second substrate structures with underfill injected into a substrate structure interface through a feature of the substrate structure, a heat spreader, and the like.

Apparatus and methods for an underfilled integrated circuit package

A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

Integrated circuit cartridge and method of fabricating the same

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Chandler, AZ, United States of America

Peter D Brandenburger