The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Oct. 08, 2002
Kris J. Whittenburg, Tempe, AZ (US);
Fay Hua, San Jose, CA (US);
Carl L. Deppisch, Phoenix, AZ (US);
Sabina J. Houle, Phoenix, AZ (US);
Peter Brandenburger, Chandler, AZ (US);
Kim L. Phillippe, Phoenix, AZ (US);
Kris J. Whittenburg, Tempe, AZ (US);
Fay Hua, San Jose, CA (US);
Carl L. Deppisch, Phoenix, AZ (US);
Sabina J. Houle, Phoenix, AZ (US);
Peter Brandenburger, Chandler, AZ (US);
Kim L. Phillippe, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.