Redwood City, CA, United States of America

Per Sverdrup

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Per Sverdrup. Retrieved from https://idiyas.com/inventor/per-sverdrup

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Per Sverdrup: Inventor in Semiconductor Design Automation.

Introduction

Per Sverdrup is an inventor based in Redwood City, California, and is associated with Intel Corporation. His work includes a patent concerning automated design methods for multi-die semiconductor packages.

Latest Patents

Sverdrup is credited with 1 patent: “Methods and Apparatus to Automate a Design Including Routing Between Dice.” The patent describes methods, systems, and apparatus that use processor circuitry and machine-readable instructions to obtain a register-transfer-level design for electrical circuits on two dice in a semiconductor package. The second die is stacked on the first, and the system selects a cell placement for the package’s physical layout based on the design. The selected cell includes a via that electrically connects the two dice.

Career Highlights

The patent reflects work at the intersection of semiconductor design automation, physical layout, and multi-die integration. These techniques address the placement and electrical interconnection of components in stacked-die packages.

Collaborations

Prashant Majhi is identified as Sverdrup’s coworker. The available information does not specify their particular roles or contributions to the patent.

Conclusion

Per Sverdrup’s patent focuses on automating physical design decisions and routing between stacked dice, supporting the development of multi-die semiconductor packages.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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