Bengaluru, India

Pavan Vishwanath

USPTO Granted Patents = 3 

Average Co-Inventor Count = 13.1

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2019-2022

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3 patents (USPTO):

Title: Pavan Vishwanath: Innovator in Sintering Technologies

Introduction

Pavan Vishwanath is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of sintering technologies, holding a total of 3 patents. His work focuses on innovative methods and materials that enhance the efficiency and effectiveness of die attachment processes.

Latest Patents

Pavan's latest patents include advancements in sintering materials and attachment methods. One of his key inventions involves methods for die attachment of multichip and single components, including flip chips. This process may utilize printing techniques such as stencil printing, screen printing, or dispensing to apply a sintering paste on substrates or the back side of dies. Additionally, he has developed sintering films that can be fabricated and transferred to wafers, dies, or substrates. A post-sintering step is also included to increase throughput. His sintering paste comprises a particulate with a mean longest diameter of less than 10 microns, where some particles are metal partially coated with a capping agent. This innovation allows for the creation of a sintered joint by sintering the powder, paste, or film in proximity to two or more workpieces.

Career Highlights

Pavan Vishwanath is currently employed at Alpha Assembly Solutions Inc., where he continues to push the boundaries of technology in his field. His work has garnered attention for its practical applications and potential to improve manufacturing processes.

Collaborations

Pavan collaborates with talented individuals such as Ranjit Pandher and Bawa Singh, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Pavan Vishwanath stands out as a key figure in the realm of sintering technologies, with a focus on enhancing die attachment methods. His contributions through patents and collaborative efforts reflect his commitment to advancing the field.

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