The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jun. 12, 2015
Applicant:
Alpha Assembly Solutions Inc., South Plainfield, NJ (US);
Inventors:
Shamik Ghoshal, Bangalore, IN;
V. Sathish Kumar, Bangalore, IN;
Pavan Vishwanath, Bangalore, IN;
Ranjit S. Pandher, Plainsboro, NJ (US);
Remya Chandran, Bangalore, IN;
Sutapa Mukherjee, Bangalore, IN;
Siuli Sarkar, Bangalore, IN;
Bawa Singh, Marlton, NJ (US);
Ravindra Mohan Bhatkal, East Brunswick, NJ (US);
Assignee:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/07 (2022.01); H01L 23/00 (2006.01); B22F 7/04 (2006.01); B22F 3/10 (2006.01); B22F 1/16 (2022.01); B23K 35/02 (2006.01); B22F 1/17 (2022.01); B22F 3/22 (2006.01); B22F 5/00 (2006.01); H01L 21/683 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 35/30 (2006.01); H01L 21/78 (2006.01); B23K 101/40 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
B22F 1/07 (2022.01); B22F 1/16 (2022.01); B22F 3/1017 (2013.01); B22F 3/22 (2013.01); B22F 5/006 (2013.01); B22F 7/04 (2013.01); B23K 1/0016 (2013.01); B23K 3/0607 (2013.01); B23K 35/0244 (2013.01); B23K 35/3006 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); B22F 1/17 (2022.01); B22F 2007/047 (2013.01); B22F 2301/255 (2013.01); B22F 2999/00 (2013.01); B23K 2101/40 (2018.08); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/11009 (2013.01); H01L 2224/1144 (2013.01); H01L 2224/11332 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11438 (2013.01); H01L 2224/11505 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/1338 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/1349 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13295 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13363 (2013.01); H01L 2224/13384 (2013.01); H01L 2224/13387 (2013.01); H01L 2224/13393 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13439 (2013.01); H01L 2224/13444 (2013.01); H01L 2224/13455 (2013.01); H01L 2224/13464 (2013.01); H01L 2224/13469 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27002 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27009 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2744 (2013.01); H01L 2224/2782 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27438 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/27821 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2938 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/2969 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29295 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29363 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29384 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29464 (2013.01); H01L 2224/29469 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75316 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81948 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83222 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0463 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/2011 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H01L 2924/20108 (2013.01); H01L 2924/20109 (2013.01); H05K 3/32 (2013.01); H05K 2203/1131 (2013.01);
Abstract
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
Ghoshal, Shamik. (2022). Sintering materials and attachment methods using same (U.S. Patent No. 11389865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11389865
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile