The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Oct. 29, 2013
Applicant:

Alpha Assembly Solutions Inc., Somerset, NJ (US);

Inventors:

Shamik Ghosal, Bangalore, IN;

Ranjit Pandher, South Plainfield, NJ (US);

Oscar Khaselev, Monmounth Junction, NJ (US);

Ravi Bhatkal, South Plainfield, NJ (US);

Rahul Raut, South Plainfield, NJ (US);

Bawa Singh, Voorhees, NJ (US);

Morgana Ribas, Bangalore, IN;

Siuli Sarkar, Bangalore, IN;

Sutapa Mukherjee, Bangalore, IN;

Sathish Kumar, Bangalore, IN;

Remya Chandran, Bangalore, IN;

Pavan Vishwanath, Bangalore, IN;

Ashok Pachamuthu, Bangalore, IN;

Monnir Boureghda, Bangalore, IN;

Nitin Desai, Bangalore, IN;

Anna Lifton, Bangalore, IN;

Nirmalya Kumar Chaki, Bangalore, IN;

Assignee:

Alpha Assembly Solutions Inc., Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 1/02 (2006.01); C01G 5/00 (2006.01); C09C 1/62 (2006.01); C09C 3/08 (2006.01); C09K 5/14 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B22F 1/0011 (2013.01); B22F 1/0014 (2013.01); B22F 1/0062 (2013.01); B22F 1/02 (2013.01); B82Y 30/00 (2013.01); C01G 5/00 (2013.01); C09C 1/62 (2013.01); C09C 3/08 (2013.01); B22F 1/0018 (2013.01); B22F 1/0074 (2013.01); B22F 2001/0066 (2013.01); C01P 2002/72 (2013.01); C01P 2002/88 (2013.01); C01P 2004/04 (2013.01); C01P 2004/53 (2013.01); C01P 2004/61 (2013.01); C01P 2004/64 (2013.01); C01P 2006/22 (2013.01); C01P 2006/32 (2013.01); C01P 2006/40 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.


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