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For the Inventor, By the Inventor

Austin, TX, United States of America

Paul Robert Walling

USPTO Granted Patents = 16

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 64(Granted Patents)


Location History:

  • Lagrangeville, NY (US) (1997 - 2001)
  • White Plains, NY (US) (2003 - 2014)
  • Austin, TX (US) (2015 - 2021)

Company Filing History:

goldMedal16 out of 164,197 
 
International Business Machines Corporation
 patents

Years Active: 1997-2021

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16 patents (USPTO):Explore Patents
1. 10956649 - Semiconductor package metal shadowing checks (2021-03-23),
2. 10949600 - Semiconductor package floating metal checks (2021-03-16),
3. 10706204 - Automated generation of surface-mount package design (2020-07-07),
4. 10546096 - Semiconductor package via stack checking (2020-01-28),
5. 10423752 - Semiconductor package metal shadowing checks (2019-09-24),
6. 10423751 - Semiconductor package floating metal checks (2019-09-24),
7. 10375820 - Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures (2019-08-06),
8. 9955567 - Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures (2018-04-24),
9. 8927879 - Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures (2015-01-06),
10. 8756546 - Elastic modulus mapping of a chip carrier in a flip chip package (2014-06-17),
11. 7325213 - Nested design approach (2008-01-29),
12. 7096451 - Mesh plane generation and file storage (2006-08-22),
13. 6528735 - Substrate design of a chip using a generic substrate design (2003-03-04),
14. 6261467 - Direct deposit thin film single/multi chip module (2001-07-17),
15. 6037044 - Direct deposit thin film single/multi chip module (2000-03-14),
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