The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Sep. 07, 2001
Harsaran S. Bhatia, Hopewell Junction, NY (US);
Raymond M. Bryant, Hopewell Junction, NY (US);
Suresh Kadakia, Poughkeepsie, NY (US);
David C. Long, Wappingers Falls, NY (US);
Paul R. Walling, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of substrate design of a multilayer ceramic module that uses menu die of the same size. One of these menu die provides a “generic” substrate design having internal wiring with the greatest number of input/output (I/O) signal leads of all the dies available. Middle (redistribution) layers include electrical interconnections for both power and the I/O signal lead wires between the die interface terminals and a bottom surface metallurgy (BSM) layer that has electrical connector pads by use of a customization layer.