Dresden, Germany

Patrick Lomtscher


Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2007-2021

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2 patents (USPTO):

Title: The Innovations of Inventor Patrick Lomtscher

Introduction

Patrick Lomtscher is a prominent inventor based in Dresden, Germany, known for his contributions to the field of semiconductor technology. With two patents to his name, he has made significant advancements that enhance the efficiency and accuracy of wafer processing.

Latest Patents

Lomtscher's latest patents include a **wafer exposure method using wafer models** and **wafer fabrication assembly**. This innovative method enables the extraction of critical dimension values from wafer structures at predefined measurement sites. By determining coefficients of a preset model in conjunction with another model featuring different terms, the technology allows for a more precise approximation of critical dimension values based on process parameters and position coordinates. His second patent focuses on **optimizing light path uniformity in inspection systems**. This system comprises an illumination source, imaging pathways, and a controller that adjusts the illumination based on image analysis of a sample point, effectively improving illumination uniformity.

Career Highlights

Throughout his career, Patrick Lomtscher has worked with notable companies in the tech sector, including Qoniac GmbH and Infineon Technologies AG. His experience at these companies has positioned him as a valuable asset in the development of advanced technologies related to wafer processing and inspection.

Collaborations

Lomtscher's collaborative efforts include working alongside esteemed colleagues such as Stefan Buhl and Philip Groeger. These partnerships have fostered innovation and have been essential in bringing his groundbreaking ideas to fruition.

Conclusion

In conclusion, Patrick Lomtscher's contributions to the semiconductor industry demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to enhancing wafer processing techniques and inspection systems, paving the way for future developments in this critical field.

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