Patrick Lin

Title: Patrick Lin: Innovator in Cache Memory and IC Packaging

Introduction

Patrick Lin is a notable inventor based in Hsin Tien, Taiwan. He has made significant contributions to the fields of cache memory and integrated circuit (IC) packaging. With a total of 2 patents to his name, Lin's work has had a considerable impact on technology.

Latest Patents

One of Lin's latest patents is titled "Structure and method of cache memory data update." This invention relates to a structure and method for updating data in a cache memory within a local processor. It utilizes cache control features to enhance performance. The design involves mapping a buffer block of a header buffer to various memory address sectors. When the local processor encounters a cache miss, it requests new data from the header buffer's buffer blocks, leading to improved cache update performance and faster packet access.

Another significant patent is the "Ball-grid array IC packaging frame." This invention features a ball-grid array (BGA) IC packaging frame that includes multiple tin balls on the rear surface of a BGA package. It also incorporates supporting pads around the rear surface to prevent non-contact soldering and short circuits during the manufacturing process of BGA ICs mounted on printed circuit boards (PCBs).

Career Highlights

Patrick Lin is currently employed at Via Technologies, Inc., where he continues to innovate and develop new technologies. His work at the company has allowed him to explore various aspects of electronic design and manufacturing.

Collaborations

Lin collaborates with several professionals in his field, including his coworker Wei-Pin Chen. Their teamwork has contributed to advancements in technology and the successful development of innovative products.

Conclusion

Patrick Lin's contributions to cache memory and IC packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications in modern electronics.