The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Apr. 05, 1999
Applicant:
Inventor:
Patrick Lin, Taoyuan, TW;
Assignee:
Via Technologies, Inc., Taipei Hsien, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
A ball-grid array (BGA) IC packaging frame of the invention includes a plurality of ball-grid array tin balls formed on the rear surface of a BGA package and a plurality of supporting pads formed on the surrounding of the rear surface. The designed supporting pads can efficiently prevent a non-contact soldering and a short circuit when a BGA IC is mounted on a PCB during manufacturing.