Kempele, Finland

Pasi Raappana

USPTO Granted Patents = 18 

 

Average Co-Inventor Count = 6.1

ph-index = 4

Forward Citations = 42(Granted Patents)


Location History:

  • Oulunsalo, FI (2019 - 2021)
  • Kempele, FI (2017 - 2022)

Company Filing History:


Years Active: 2017-2022

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18 patents (USPTO):Explore Patents

Title: Innovations of Pasi Raappana in Electromechanical Structures

Introduction

Pasi Raappana is a prominent inventor based in Kempele, Finland. With a remarkable portfolio consisting of 18 patents, he has made significant contributions to the field of electromechanical structures. His recent innovations showcase cutting-edge methods in manufacturing technology that blend electronic components seamlessly with advanced materials.

Latest Patents

Raappana's latest patents include a novel "Method for manufacturing an electromechanical structure" and a "System for manufacturing an electromechanical structure." The method focuses on producing conductors on a flat film and estimating the strain at multiple locations as the film is shaped into a three-dimensional structure. By strategically attaching electronic elements to minimize deformation, the process enhances the efficiency and functionality of hybrid systems. The system described involves a coordinated setup where various entities work together to ensure precise production, utilizing techniques such as thermoforming, vacuum forming, and blow molding.

Career Highlights

Currently, Raappana is associated with Tactotek Oy, an innovative company specializing in the integration of electronics with injection-molded three-dimensional structures. His expertise has played an essential role in advancing the company's product offerings and aligning them with modern manufacturing demands. The combination of his inventive skills and hands-on experience has positioned Tactotek Oy as a leader in the field.

Collaborations

Throughout his career, Raappana has had the opportunity to work alongside talented colleagues such as Mikko Heikkinen and Jarmo Sääski. These collaborations have fostered an environment of creativity and innovation, enabling the team to push the boundaries of what is possible in electromechanical design and manufacturing.

Conclusion

Pasi Raappana's impactful work in the realm of electromechanical structures is paving the way for future innovations in manufacturing technologies. His ability to incorporate electrical functionality into flexible and dynamic designs continues to inspire and set new standards within the industry. As he further develops his patent portfolio, the contributions of Raappana are sure to influence the evolution of electromechanical systems for years to come.

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