The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Oct. 10, 2018
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Jarmo Sääski, Oulunsalo, FI;

Jarkko Torvinen, Oulunsalo, FI;

Pasi Raappana, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); B29C 45/14 (2006.01); B32B 27/08 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); B29C 45/14639 (2013.01); B29C 45/14819 (2013.01); B32B 27/08 (2013.01); H05K 1/0266 (2013.01); H05K 1/0274 (2013.01); H05K 1/0313 (2013.01); H05K 1/144 (2013.01); H05K 1/185 (2013.01); H05K 3/12 (2013.01); H05K 3/285 (2013.01); H05K 3/368 (2013.01); B29L 2031/34 (2013.01); B32B 2457/00 (2013.01); G06F 2203/04101 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09936 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.


Find Patent Forward Citations

Loading…