The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Oct. 24, 2018
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Mikko Heikkinen, Oulu, FI;

Jarmo Sääski, Kempele, FI;

Jarkko Torvinen, Kempele, FI;

Paavo Niskala, Oulu, FI;

Mikko Sippari, Oulunsalo, FI;

Pasi Raappana, Kempele, FI;

Antti Keränen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B29C 45/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); B29C 45/1418 (2013.01); B29C 45/14639 (2013.01); B29C 45/14819 (2013.01); H05K 1/0284 (2013.01); H05K 1/0393 (2013.01); B29C 45/14811 (2013.01); B29C 2045/14237 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/3481 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/1105 (2013.01);
Abstract

A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.


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