The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Nov. 28, 2018
Applicant:
Tactotek Oy, Oulunsalo, FI;
Inventors:
Tomi Simula, Oulunsalo, FI;
Vinski Bräysy, Oulunsalo, FI;
Mikko Heikkinen, Oulunsalo, FI;
Juha-Matti Hintikka, Oulunsalo, FI;
Juhani Harvela, Oulunsalo, FI;
Minna Pirkonen, Oulunsalo, FI;
Pasi Raappana, Oulunsalo, FI;
Tuomas Heikkilä, Oulunsalo, FI;
Jarmo Sääski, Oulunsalo, FI;
Assignee:
TACTOTEK OY, Oulunsalo, FI;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/32 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0203 (2013.01); H05K 1/11 (2013.01); H05K 1/144 (2013.01); H05K 1/185 (2013.01); H05K 3/0014 (2013.01); H05K 3/32 (2013.01); H05K 3/40 (2013.01); H05K 3/4644 (2013.01); H05K 2201/042 (2013.01); H05K 2201/066 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/1305 (2013.01);
Abstract
An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.