Company Filing History:
Years Active: 2011-2012
Title: Paolo Carnevali: Innovator in Thermal Simulation Technologies
Introduction
Paolo Carnevali is a notable inventor based in San Jose, California, recognized for his contributions to thermal simulation technologies in semiconductor design. With a total of two patents to his name, Carnevali has made significant strides in integrating thermal awareness into the design automation of semiconductor chips.
Latest Patents
Carnevali's latest patents include a thermally aware design automation suite that performs fine-grain static and transient thermal simulations of semiconductor chips. This suite utilizes adaptive 3D and hierarchical grid mechanisms to enhance the accuracy of thermal simulations based on various thermal models and boundary conditions. The adaptive grid techniques employed allow for finer grids in regions with higher temperature gradients, while hierarchical grid techniques analyze critical, intermediate, and boundary regions with respective grid resolutions. Additionally, his transient thermal analysis patent enables spatio-temporal thermal analysis of semiconductor chips, tracking temperature changes over time and updating power dissipations accordingly. This innovative approach allows for user-definable control parameters, facilitating efficient thermal analysis and communication of results with integrated circuit designers.
Career Highlights
Throughout his career, Paolo Carnevali has worked with prominent companies such as Gradient Design Automation Inc. and Complete Genomics, Inc. His experience in these organizations has contributed to his expertise in thermal simulation and semiconductor design.
Collaborations
Carnevali has collaborated with notable professionals in the field, including Rajit Chandra and John Yanjiang Shu. These collaborations have further enriched his work and innovations in thermal simulation technologies.
Conclusion
Paolo Carnevali's contributions to thermal simulation in semiconductor design highlight his innovative spirit and technical expertise. His patents reflect a commitment to advancing the field and improving the efficiency of thermal analysis in integrated circuits.
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