Pamela A O'Brien

Title: Pamela A. O’Brien: Semiconductor Packaging Inventor

Introduction

Pamela A. O’Brien is an inventor associated with Chandler, Arizona, and Freescale Semiconductor, Inc. Her patent work addresses semiconductor package design and manufacturing, particularly features that improve soldering and inspection of no-lead packages. She is named on 2 patents.

Latest Patents

O’Brien’s listed patents focus on making lead ends solder-wettable and improving the optical inspection of solder joints.

“Wettable Lead Ends on a Flat-Pack No-Lead Microelectronic Package” describes methods for coating exposed base metal at the cut ends of a package’s lead frame with solder. The coating can be applied while the package remains in a strip or after it has been singulated. Making the lead ends solder-wettable helps form solder fillets when the package is mounted on a printed circuit board.

“Providing an Automatic Optical Inspection Feature for Solder Joints on Semiconductor Packages” concerns features that make solder joints on no-lead packages easier to inspect optically. The described approaches use lead-frame features and molding techniques that keep molding material from covering selected areas. A solderable surface on the lead frame can help those exposed features form visible indicators during solder reflow.

Career Highlights

O’Brien’s listed inventions address practical challenges in semiconductor assembly. Her work connects package and lead-frame design with reliable board mounting and inspection, supporting manufacturing processes that depend on sound solder joints.

Collaborations

The supplied information associates O’Brien with Freescale Semiconductor, Inc. Her listed coworkers include Dwight Lee Daniels and Alan J. Magnus. The patent descriptions reflect work involving package structures, lead frames, molding, and soldering processes.

Conclusion

Pamela A. O’Brien’s two listed patents focus on improving solder wetting and optical inspection in semiconductor packaging, highlighting her contributions to practical manufacturing and assembly challenges.