The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Nov. 29, 2012
David F. Abdo, Scottsdale, AZ (US);
Pamela A. O'brien, Chandler, AZ (US);
David F. Abdo, Scottsdale, AZ (US);
Pamela A. O'Brien, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A mechanism is provided by which optically-inspectable features formed during surface mount bonding of no-leads packages are enhanced. Embodiments of the present invention use a lead frame having features that will lie upon the edges of the finished semiconductor device package, where molding material is prevented from lying in those features through the use of a preplaced film on the lead frame or film-assisted molding in conjunction with a mold chase that conforms to the features provided on the lead frame. Embodiments use a lead frame that has a pre-plated solderable surface, such that the exposed features enhance formation of the optically-inspectable features during solder reflow operations of PCB mounting.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile