Hsin-Chu, Taiwan

Pai-Wei Wan


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Pai-Wei Wan: Innovator in Semiconductor Technology

Introduction

Pai-Wei Wan is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that enhances the fabrication of integrated circuits.

Latest Patents

Wan holds a patent for a "Multiple patterning method for semiconductor devices." This patent discloses a method of fabricating an integrated circuit (IC) using a multiple (N>2) patterning technique. The method provides a layout of the IC featuring a set of IC features. It includes deriving a graph from the layout, where the vertices represent the IC features and the edges represent the spacing between these features. The method involves selecting vertices that are not directly connected by an edge but share at least one neighboring vertex connected by N edges. Furthermore, it utilizes a computerized IC tool to merge the selected vertices, thereby reducing the number of edges connecting the neighboring vertex to below N. The process also includes removing vertices connected by fewer than N edges.

Career Highlights

Pai-Wei Wan is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing semiconductor fabrication techniques, which are crucial for the development of modern electronic devices.

Collaborations

Wan has collaborated with notable colleagues, including Ken-Hsien Hsieh and Chih-Ming Lai, who contribute to the innovative environment at their workplace.

Conclusion

Pai-Wei Wan's contributions to semiconductor technology through his patent demonstrate his commitment to innovation in the field. His work continues to influence the development of integrated circuits, showcasing the importance of advancements in semiconductor fabrication methods.

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