Pai-Sheng Cheng

Title: Innovations of Pai-Sheng Cheng

Introduction

Pai-Sheng Cheng is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of technology, particularly in the area of circuit board design and packaging. With a total of six patents to his name, Cheng has demonstrated a commitment to innovation and advancement in his field.

Latest Patents

Cheng's latest patents include a flip chip package that features a substrate, a chip body bonded to the substrate, and bumps connecting the chip body and the substrate. This innovative design includes input and output wires, with the chip body extending continuously between two seal rings. Each input wire overlaps the chip body, connecting to a first bonding region on the substrate, while each output wire connects to a second bonding region located on the opposite side of the chip body. Another significant patent involves a circuit board that includes a substrate, at least one lead, at least one bump, and a solder layer. The lead is positioned on the substrate, with the bump placed on the lead and covered by the solder layer.

Career Highlights

Cheng is currently employed at Himax Technologies, Inc., where he continues to develop innovative solutions in the technology sector. His work has been instrumental in advancing the capabilities of circuit boards and packaging technologies.

Collaborations

Cheng collaborates with talented individuals such as Chia-Hui Wu and Chiu-Shun Lin, contributing to a dynamic and innovative work environment.

Conclusion

Pai-Sheng Cheng's contributions to technology through his patents and work at Himax Technologies, Inc. highlight his role as a leading inventor in the field. His innovative designs and collaborative efforts continue to push the boundaries of technology.