The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Oct. 05, 2011
Applicants:
Pai-sheng Cheng, Tainan, TW;
Chia-hui Wu, Tainan, TW;
Inventors:
Pai-Sheng Cheng, Tainan, TW;
Chia-Hui Wu, Tainan, TW;
Assignee:
Himax Technologies Limited, Xinshi Dist., Tainan, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/28 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump.
Cheng, Pai-Sheng. (2014). Circuit board, fabricating method thereof and package structure (U.S. Patent No. 8674503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8674503
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile