The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Mar. 28, 2008
Chiu-shun Lin, Tainan County, TW;
Pai-sheng Cheng, Tainan County, TW;
Chiu-Shun Lin, Tainan County, TW;
Pai-Sheng Cheng, Tainan County, TW;
Himax Technologies Limited, Fonghua Village, Sinshih Township, Tainan County, TW;
Abstract
A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The first conductive foil is disposed on the first surface of the substrate and has a first designated pattern for bump bonding. The second conductive foil is disposed on the second surface of the substrate and has a second designated pattern, wherein the area of the second designated pattern is not smaller than the area of the first designated pattern.