The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Nov. 01, 2004
Pai-sheng Cheng, Tainan, TW;
Pai-Sheng Cheng, Tainan, TW;
Himax Technologies Inc., Tainan, TW;
Abstract
A semiconductor package includes a chip and a carrier. The chip has an active surface and a lateral surface. The active surface has a number of first bumps and a number of second bumps. The first bumps are spaced by the second bumps. The first bumps are farther from the lateral surface than the second bumps are. The carrier has a base and a number of first inner leads. Each first inner lead has a body portion and a distal end bonding portion. The width of the body portion is smaller than that of the distal end bonding portion. The distal end bonding portions are electrically bonded to the first bumps such that the chip is disposed on the carrier, and each of the body portions is located between the two adjacent second bumps.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile