Kyoto, Japan

Osamu Nakagawa


Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 47(Granted Patents)


Location History:

  • Nagaokakyo, JP (1987)
  • Kyoto, JP (1992 - 2006)

Company Filing History:


Years Active: 1987-2006

Loading Chart...
7 patents (USPTO):

Title: Innovator Osamu Nakagawa: Pioneering Advances in Semiconductor Technology

Introduction

Osamu Nakagawa, an accomplished inventor based in Kyoto, Japan, has made significant contributions to the field of semiconductor technologies. With a total of 7 patents to his name, he is known for his innovative methods and apparatuses that enhance the efficiency and precision of electronic component fabrication. His work has played a crucial role in advancing semiconductor devices and encapsulation techniques.

Latest Patents

Nakagawa's recent patents include the following:

1. **Method of Resin Encapsulation** - This patent details a process where a board is placed on a board mounting portion, followed by fitting a resin material into a cavity formed in a lower mold. The resin is heated to a melted state and then immersed with chips and wires during mold closure, resulting in a resin mold product.

2. **Apparatus for Resin Encapsulation** - Complementing his previous patent, this apparatus facilitates the encapsulation method, ensuring a precise fit and effective sealing of electronic components with resin.

3. **Method of Manufacturing Semiconductor Device** - This method consists of using a tool to press a chip against a substrate and heat them, connecting electrode pairs via bumps while maintaining precise alignment within die alignment planes. It details an efficient way to create high-precision electronic components.

4. **Semiconductor Device and Resin Material** - This innovation focuses on creating a semiconductor device that efficiently combines components with a protective resin layer, ensuring durability and functionality.

5. **Method of Fabricating an Electronic Component and Apparatus Used Therefor** - By providing an efficient way to collectively resin-seal chips with high precision, this invention significantly enhances the manufacturing process of electronic components.

Career Highlights

Throughout his career, Osamu Nakagawa has worked with prominent companies such as Murata Kikai Kabushiki Kaisha and Towa Corporation. His expertise in semiconductor technology and resin encapsulation has helped these companies improve their manufacturing processes and product reliability.

Collaborations

Nakagawa has collaborated with talented individuals in the field, including his coworkers Tomonari Ikemoto and Hideyuki Oe. Their collective efforts have fostered a creative environment that has led to groundbreaking innovations within the semiconductor industry.

Conclusion

Osamu Nakagawa stands out as a significant figure in the realm of semiconductor technology, with a proven track record of innovation reflected in his numerous patents. His contributions not only demonstrate his ingenuity but also play a vital role in the ongoing advancements of electronic components, ensuring efficiency and precision in their manufacturing processes. As the industry evolves, his work will likely continue to influence future technological developments.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…