The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Nov. 20, 2003
Hiroshi Uragami, Kyoto, JP;
Osamu Nakagawa, Kyoto, JP;
Kinya Fujino, Kyoto, JP;
Shinji Takase, Kyoto, JP;
Hideki Tokuyama, Kyoto, JP;
Koichi Meguro, Kawasaki, JP;
Toru Nishino, Kawasaki, JP;
Noboru Hayasaka, Kawasaki, JP;
Hiroshi Uragami, Kyoto, JP;
Osamu Nakagawa, Kyoto, JP;
Kinya Fujino, Kyoto, JP;
Shinji Takase, Kyoto, JP;
Hideki Tokuyama, Kyoto, JP;
Koichi Meguro, Kawasaki, JP;
Toru Nishino, Kawasaki, JP;
Noboru Hayasaka, Kawasaki, JP;
Towa Corporation, Kyoto, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.