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Osamu Moriya

This inventor holds 16 USPTO granted patents. Top assignees: Kabushiki Kaisha Toshiba, Lintec Corporation, Hitachi, Ltd.. Active years: 1998-2019.

USPTO Granted Patents = 16

% Patents Active = 62.5

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 515(Granted Patents)

Location History:

Kawasaki, JP (1998 - 2000)
Kanagawa, JP (2002 - 2006)
Yokosuka, JP (2011 - 2013)
Yokohama, JP (2001 - 2019)

Company Filing History:

9 out of 53,240

Kabushiki Kaisha Toshiba

Years Active: 1998-2019

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10224291 - Semiconductor device package with strip line structure and high frequency semiconductor device thereof (2019-03-05),

2. 9887676 - High frequency semiconductor amplifier (2018-02-06),

3. 8470953 - Sealing material for optical element and sealed optical element (2013-06-25),

4. 8080604 - Adhesive containing ladder-type polysilsesquioxane and adhesive sheet (2011-12-20),

5. 8026332 - Sealing material for optical element and sealed optical element (2011-09-27),

6. 7759406 - Process for producing polysilsesquioxane graft polymer, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet (2010-07-20),

7. 7257637 - Method for transforming data between business protocols (2007-08-14),

8. 7151758 - Router device, datagram transfer method and communication system realizing handoff control for mobile terminals (2006-12-19),

9. 6965946 - Method and apparatus for communication control of mobile computers in communication network systems using private IP addresses (2005-11-15),

10. 6544641 - Silicate-containing sheet (2003-04-08),

11. 6473411 - Router device, datagram transfer method and communication system realizing handoff control for mobile terminals (2002-10-29),

12. 6442616 - Method and apparatus for communication control of mobil computers in communication network systems using private IP addresses (2002-08-27),

13. 6284364 - Silicate-containing sheet (2001-09-04),

14. 6108535 - Mobile communication system including service management of traffic (2000-08-22),

15. 5832363 - Mobile communication system including service management of traffic (1998-11-03),

Title: The Innovations of Osamu Moriya

Introduction

Osamu Moriya is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work has been instrumental in advancing high-frequency semiconductor devices.

Latest Patents

Moriya's latest patents include a semiconductor device package with a strip line structure and a high-frequency semiconductor device. This innovative package features a metal plate, a frame body, and conductive layers designed to enhance performance. Another notable patent is for a high-frequency semiconductor amplifier, which incorporates a monolithic microwave integrated circuit and a unique package base part. These inventions reflect his expertise in creating efficient and effective semiconductor solutions.

Career Highlights

Throughout his career, Osamu Moriya has worked with notable companies such as Toshiba Corporation and Lintec Corporation. His experience in these organizations has allowed him to develop cutting-edge technologies that have had a lasting impact on the industry.

Collaborations

Moriya has collaborated with esteemed colleagues, including Toshio Sugizaki and Toshio Okamoto. These partnerships have fostered innovation and contributed to the success of his projects.

Conclusion

Osamu Moriya's contributions to semiconductor technology are noteworthy and demonstrate his commitment to innovation. His patents and collaborations highlight his role as a leading inventor in the field.

Profile summary based on public USPTO records.

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