Melaka, Malaysia

Nurfarena Othman

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2021

where 'Filed Patents' based on already Granted Patents

4 patents (USPTO):

Title: Nurfarena Othman: Innovating Semiconductor Packages for the Future

Introduction:

In the realm of semiconductor technology, innovation and expertise play a crucial role in driving advancements and enhancing performance. One notable inventor who has made significant contributions in this field is Nurfarena Othman, based in Melaka, Malaysia. With a commendable record of four patents to his name, Othman has continued to push the boundaries of semiconductor package designs, revolutionizing their thermal and electrical conductivities.

Latest Patents:

Othman's latest patents demonstrate his expertise in improving the thermal and electrical capabilities of semiconductor packages. One such patent, labeled "Porous Cu on Cu Surface for Semiconductor Packages," outlines a semiconductor package with enhanced thermal conductivity (ranging from 340 to 400 W/mK) and electrical conductivity (ranging from 80 to 110% IACS). This breakthrough allows for more efficient heat dissipation and improved overall performance.

Another noteworthy patent is the "Leadframe, Semiconductor Package Including a Leadframe, and Method for Forming a Semiconductor Package." This invention focuses on optimizing the leadframe design within a semiconductor housing. By arranging the lower surface of the contact pads and the first die pad in a specific plane and elevating the upper surface of the second die pad, Othman improves the efficiency and reliability of the semiconductor package.

Career Highlights:

Nurfarena Othman's career is closely aligned with his passion for innovation in semiconductor technology. He is currently associated with Infineon Technologies AG, a prominent global player in the semiconductor industry. Infineon Technologies AG has been at the forefront of semiconductor research and development, consistently pushing the boundaries of what is possible. Othman's affiliation with this esteemed company underscores his contributions to the field.

Collaborations:

Innovation often thrives in collaborative environments, and Othman's journey is no exception. Throughout his career, he has had the opportunity to work alongside accomplished individuals in the semiconductor industry. Notable coworkers include Thomas Bemmerl and Azlina Kassim, both of whom bring their unique expertise and insights to the table. Collaborative efforts with these professionals have undoubtedly played a role in Nurfarena Othman's impressive patent portfolio.

Conclusion:

Nurfarena Othman is a highly proficient and dedicated inventor who has made remarkable strides in the development of semiconductor packages. His patents reflect a commitment to improving the thermal and electrical properties of these packages, leading to enhanced performance and reliability. Othman's contributions, alongside his collaboration with experts within the industry, highlight his dedication to advancing the semiconductor technology landscape. With a wealth of experience and a passion for discovery, Nurfarena Othman is a driving force behind the innovations that shape our technological future.

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