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For the Inventor, By the Inventor

Ageo, Japan

Noriyuki Nagashima

This inventor holds 3 USPTO granted patents. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Noriyuki Nagashima. Retrieved from https://idiyas.com/inventor/noriyuki-nagashima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 66.7

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal3 out of 817 
 
Mitsui Minings & Melting Co., Ltd.
 patents

Years Active: 2006-2011

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3 patents (USPTO):Explore Patents
1. 7927453 - Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer (2011-04-19),
2. 7163600 - Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer (2007-01-16),
3. 7144472 - Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method (2006-12-05),

Title: Noriyuki Nagashima: Innovator in Copper Foil Technology

Introduction

Noriyuki Nagashima is a prominent inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the manufacturing of copper foil with insulating layers. With a total of 3 patents to his name, Nagashima's work focuses on enhancing the efficiency and effectiveness of electronic components.

Latest Patents

Nagashima's latest patents include a method of manufacturing copper foil with an insulating layer, a copper foil with an insulating layer obtained through this method, and a printed circuit board utilizing the same copper foil. These innovations aim to provide a method for creating a skeletal component that is as thin as possible, ensuring that it can be securely contained within an insulating layer of a manufactured copper clad laminate. The method involves applying a semi-cured insulating resin layer containing a skeletal component on one side of the copper foil, which is characterized by the use of a first thermosetting resin layer in an uncured or semi-cured state.

Career Highlights

Nagashima is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to develop advanced materials for various applications. His expertise in the field has positioned him as a key player in the innovation of copper foil technology.

Collaborations

One of his notable collaborators is Tetsuro Sato, with whom he has worked closely to advance their research and development efforts in the industry.

Conclusion

Noriyuki Nagashima's contributions to the field of copper foil technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and a dedication to improving electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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