Mitsui Minings & Melting Co., Ltd.

Noriyuki Nagashima

Tetsuro Sato

To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted 'a method of manufacturing a copper foil with an insulating layerwhich method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layerin an uncured or semi-cured state.

Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer

To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted 'a method of manufacturing a copper foil with an insulating layerwhich method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layerin an uncured or semi-cured state is provided on one side surface of a copper foil; a nonwoven fabricor a woven clothto be a skeletal component is press-bonded onto a first thermosetting resin layer; a second thermosetting resin layeris formed on a surface of a press-bonded nonwoven fabricor woven cloth; and a semi-cured insulating layer containing the nonwoven fabricor the woven clothis formed on one side surface of the copper foilby drying into a semi-cured state.'

Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer

A production method capable of stably producing a prepreg and a copper foil with thin insulating layer using a thin backbone material capable of securing excellent laser hole-making property. A method for producing a prepreg for use in producing a printed wiring board having a backbone material impregnated with a thermosetting resin comprising the following steps is adopted:

Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method

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Ageo, Japan

Noriyuki Nagashima