The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Nov. 22, 2002
Tetsuro Sato, Ageo, JP;
Noriyuki Nagashima, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Noriyuki Nagashima, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted 'a method of manufacturing a copper foil with an insulating layerwhich method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layerin an uncured or semi-cured state is provided on one side surface of a copper foil; a nonwoven fabricor a woven clothto be a skeletal component is press-bonded onto a first thermosetting resin layer; a second thermosetting resin layeris formed on a surface of a press-bonded nonwoven fabricor woven cloth; and a semi-cured insulating layer containing the nonwoven fabricor the woven clothis formed on one side surface of the copper foilby drying into a semi-cured state.'