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For the Inventor, By the Inventor

Chiba, Japan

Norimasa Nakamura

This inventor holds 15 USPTO granted patents. Top assignees: Nisshinbo Industries, Inc., Nisshinbo Chemical Inc., Other. Active years: 1997-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Norimasa Nakamura. Retrieved from https://idiyas.com/inventor/norimasa-nakamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15

% Patents Active = 93.3

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 63(Granted Patents)


Location History:

  • Tokyo, JP (1997 - 2002)
  • Chiba, JP (2001 - 2022)

Company Filing History:

goldMedal13 out of 423 
 
Nisshinbo Industries, Inc.
 patents
silverMedal1 out of 24 
 
Nisshinbo Chemical Inc.
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 1997-2022

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15 patents (USPTO):Explore Patents
1. 11254798 - One-pack type adhesive and fuel cell separator (2022-02-22),
2. 7368493 - Carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition (2008-05-06),
3. 7361701 - Aliphatic polyester composition, a molded article thereof and a method for controlling biodegradation rate using the same composition (2008-04-22),
4. 6846860 - Biodegradable plastic composition, a molded article thereof and a method for controlling biodegradation rate (2005-01-25),
5. 6524711 - Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition (2003-02-25),
6. 6485833 - Resin-coated metal foil (2002-11-26),
7. 6440258 - Adhesive film for semiconductor package (2002-08-27),
8. 6420035 - Metal material subjected to treatment for seizure prevention and method for production thereof (2002-07-16),
9. 6387505 - Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board (2002-05-14),
10. 6331226 - LCP bonding method (2001-12-18),
11. 6310119 - Film-shaped encapsulating agent for electronic parts (2001-10-30),
12. 6225417 - One-pack type epoxy resin composition (2001-05-01),
13. 6103836 - Epoxy resin composition (2000-08-15),
14. 6090906 - Polycarbodiimide copolymer and process for production thereof (2000-07-18),
15. 5650476 - Process for production of polycarbodiimide resin powder (1997-07-22),

Title: Norimasa Nakamura: Innovator in Adhesive and Carbodiimide Technologies

Introduction

Norimasa Nakamura is a prominent inventor based in Chiba, Japan. He has made significant contributions to the fields of adhesive technology and carbodiimide compositions. With a total of 15 patents to his name, Nakamura's work has had a considerable impact on various industries.

Latest Patents

Nakamura's latest patents include a one-pack type adhesive and a fuel cell separator. This innovative adhesive contains an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a polycarbodiimide compound. The formulation ensures that the curing agent includes at least one amine-based curing agent, while the curing accelerator features at least one capsule-type curing accelerator. The inorganic filler is designed to be flake-like, with a specific content ratio to enhance performance. Another notable patent is a carbodiimide composition that suppresses yellowing and provides a stabilizer against hydrolysis. This composition is particularly useful in ester-group-containing resins and biodegradable plastics, showcasing improved heat resistance and stability.

Career Highlights

Throughout his career, Norimasa Nakamura has worked with Nisshinbo Industries, Inc., where he has contributed to various innovative projects. His expertise in adhesive and carbodiimide technologies has positioned him as a key figure in his field.

Collaborations

Nakamura has collaborated with notable professionals such as Hideshi Tomita and Yasuo Imashiro. These partnerships have further enriched his work and expanded the scope of his innovations.

Conclusion

Norimasa Nakamura's contributions to adhesive technology and carbodiimide compositions highlight his role as a leading inventor. His patents reflect a commitment to innovation and excellence in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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